SYCN191T1638

TOPCon Series

SYCN191T1638

Specifications

≥26%

Eff:

182.2x191.6mm

Dimension:

130±15μm

Thickness:

Highlights

High efficiency: eff≥26%; bifaciality≥80%

High efficiency: eff≥26%; bifaciality≥80%

Low temperature coefficient: TkPower≥-0.29%/℃

Low temperature coefficient: TkPower≥-0.29%/℃

PID Resistance: excellent anti-PID performance

PID Resistance: excellent anti-PID performance

N-type wafer: low degradation, no LID

N-type wafer: low degradation, no LID

Low CTM loss: more suitable for high module power

Low CTM loss: more suitable for high module power

Excellent performance at low intensity: relative conversity efficency≥ 97% at 200W/m²

Excellent performance at low intensity: relative conversity efficency≥ 97% at 200W/m²

Parameters

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The above data is for reference only, and actual testing data shall prevail.

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