SYCN182T1634

TOPCon Series

SYCN182T1634

Specifications

≥26%

Eff:

182.2x183.75mm

Dimension:

130±15μm

Thickness:

Highlights

High efficiency: eff≥26%; Bifaciality≥80%

High efficiency: eff≥26%; Bifaciality≥80%

Low temperature coefficient: TkPower≥-0.29%/℃

Low temperature coefficient: TkPower≥-0.29%/℃

PID Resistance: excellent anti-PID performance

PID Resistance: excellent anti-PID performance

N-type wafer: low degradation ,no LID

N-type wafer: low degradation ,no LID

Low CTM loss: more suitable for high module power

Low CTM loss: more suitable for high module power

Excellent performanc at low intensity: relative conversity efficency ≥97% at 200W/m²

Excellent performanc at low intensity: relative conversity efficency ≥97% at 200W/m²

Parameters

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The above data is for reference only, and actual testing data shall prevail.

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